The contact area of the contact is small and contact resistance is large. In a typical semiconductor fabrication process, the floating interconnect metal level is formed prior to the formation of the contacts and vias that connect the various circuit elements. In typical technologies, the thermal paths are formed by a so-called, xe2x80x9cfloatingxe2x80x9d interconnect metal level. The development of superior thermal paths has been a concern in the art. The dissipation of heat requires additional thermal paths to dissipate heat effectively. The dissipation of heat from the semiconductor package has lead to a number of additional concerns. A particular concern is the generation of heat by PN junctions which are used in the interface between the metal levels and the semiconductor body. A multitude of heat sinks are commonly used to dissipate heat generated by semiconductor devices. One concern is the dissipation of heat from the semiconductor package.

The density increases have also influenced the design of semiconductor packages. The increase of circuit elements per chip has lead to many problems including heat generation. Increased device density has allowed an increase of the number of circuit elements on the integrated circuits.

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